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Journal of Electrical Systems and Information Technology

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About the Society President

Sherine M. Abd El-Kader Moharram , President of Electronics Research Institute (ERI)

About the Editors

Professor Stefan Kozak , Slovak University of Technology, Slovakia

Aims and scope

Journal of Electrical Systems and Information Technology (JESIT) is an international peer-reviewed journal seeking innovation, creativity and novelty in the fields of electrical engineering and information technology. Important topics of interest include computer science, communication, power electronics, artificial intelligence, informatics and renewable energy. JESIT aims to attain the state-of-the-art research in theory and application while simultaneously providing a global platform for scientists and academics to collectively explore developments in the latest trends. The journal publishes high-quality, double-blinded peer-reviewed articles within the scope. Authors are welcome to submit reviews, research articles and letters to the Editor.

About the Society

Journal of Electrical Systems and Information Technology is the official journal of  Electronic Research Institute  (ERI).

ERI is one of the specialised institutes affiliated with the Academy of Scientific Research and Technology. Currently ERI constitutes seven departments that include more than two hundred research members interesting in the theoretical and applied fields of electronics, communications, computers, power electronics and informatics.

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At least eight die in inferno near Moscow, TASS says

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Macron's political crisis hurts business morale ahead of Paris Olympics

As President Emmanuel Macron welcomes business leaders including Elon Musk to Paris ahead of Friday's Olympic opening ceremony, there are early signs France's political deadlock is hurting business sentiment and affecting corporate decision making.

Electronics Research Institute (ERI)

ERI, was established by the Presidential Decree No. 38 in 1989. It is one of the specialized institutes affiliated to the Ministry of Scientific Research. The activities of ERI include theoretical and applied researches in the fields of electronics, communications, computers and informatics. Catering scientific consultancy services to the industrial sector, for both production and services. Currently, ERI constitutes seven departments that include more than two hundred research members to be one of the largest research entities in Egypt.

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Electronics Packaging Research Institute

What is the Auburn University Electronics Packaging Research Institute or AUERI? Previously known as CAVE3, the institute started as an Industry and University Cooperative Research Program (I/URC). In 1999, a small seed grant from the National Science Foundation was utilized to help establish the research institute. Since its inception, AUERI has formed a number of long-term partnerships with industry, government, and academic agencies. The vast majority of funding for the institute currently derives from industrial partners. Since research topics are driven by an Industrial Advisory Board (IAB) comprised of member organizations, research results are directly applicable to their needs. As electronic components become more prevalent in automotive and extreme environment applications, their reliability becomes an issue that requires costly recalls. Furthermore, when components are integrated into underhood applications, their temperatures range between -30° C and 175° C. However, they are still expected to last for 10 years/250,000 km (-22F to 350F and 150,000 miles). AUERI was founded to assist automotive and defense electronics suppliers and any entity with harsh environment electronics applications that need to meet their reliability requirements. From the very beginning of the institute's existence, it was acknowledged that other extreme environment applications shared a number of requirements with automotive electronics. Therefore, in 2009, its title was changed to NSF-CAVE3 Center for Advanced Vehicle and Extreme Environment Electronics from it initial founding title of CAVE. The CAVE3 Center has grown in size and areas of research. In 2024, the AU Board of Trustees approved the elevation of the CAVE3 Center to an Institute now called the Auburn University Electronics Packaging Research Institute. The updated name was intended to better communicate the Institute's areas of research and addresses the reliability challenges from harsh environments. Now, the institute is known as Auburn University Electronics Packaging Research Institute or AUERI.

Research areas cover challenges in:

• Semiconductor Packaging
• Chip Fabrication
• Additive Printed Electronics
• Component Reliability
• Connector Reliability
• Flip Chip and Underfills
• Harsh Electronics System and Manufacturing
• Lead free Soldering
• Prognostic Health Management (PHM) 

Bi-annual research reviews are hosted to communicate findings to member organizations. These are also implemented into a toolset entitled "E-tools," which allows member organizations to access extensive historical reliability and finite element-based simulation tools designed by AUERI researchers. The Institute offers a broad range of independent laboratory testing services and consulting to quantify the reliability of production prototypes and resolve manufacturing issues. All testing is in accordance with EDEC, ASTM, IPC, Military, UL, commercial, and customer specifications.

Message from the Director

Earlier in the fall semester of 2023, a number of AUERI researchers traveled to the SMTAI and the ASME INTERPACK conferences. The SMTAI was held in Minneapolis, MN, and the INTERPACK was held in San Diego, CA. I am glad to report that the following paper won the 1st Place Nasser Grayeli Best Poster Award:

Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits , P. Lall, V. Soni, J. Narangaparambil, S. Miller, ASME InterPACK, Paper IPACK2023-112060, pp. 1-11, San Diego, CA, Oct 24-26, 2023. In addition, the following paper placed in the top 10:

Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink , Lall, P., Bimali, S., Narangaparambil, J., Miller, S., ASME InterPACK, Paper IPACK2023-112066, San Diego, CA, pp. 1-12, Oct 24-26, 2023. In October 2023, a number of AUERI students also presented their research at the Auburn Mechanical Engineering Graduate Poster Contest. In the Design and Manufacturing Track, Daniel Karakitie, Ved Soni, and Vishal Mehta placed 1st, 2nd, and 3rd respectively. In the Mechanics Track, Golam Rakib Mazumdar, Mahbub Alam Maruf, and Mrinmoy Saha placed 1st, 2nd, and 3rd respectively. In the Electric Vehicle, Electronics Packaging, and Electronic Thermal Management Track, Souvik Chakraborty placed 3rd. The student team continued their strong performance with a number of students winning IPC Scholarships, including Sabina Bimali, Padmanava Choudhury, Ved Soni, Daniel Karakitie, Vishal Mehta, Madhu Kasturi, Aathi Pandurangan, Fatahi Musa, Md Golam Sarwar, and Shriram Kulkarni. I am delighted to report that we have kicked off four new research programs since the last review. The first program, through a completely won SRC call, is on the topic of the study of Non-PFAS alternatives for use in electronics. Owing to impending regulation under the United States TSCA and the European Union REACH, there is renewed interest in the development and identification of alternatives for use in semiconductor packaging. In the current generation of electronics, PFAS is pervasive for a number of functions related to mechanical and electrical performance and reliability. The program, which spans 3 years, is in partnership with a number of SRC member companies including Intel, Texas Instruments, and IBM. The transition to Non-PFAS materials will impact all levels of packaging and processing from the chip to package, printed circuit boards, wiring, and modules. We are excited to be at the forefront of this challenge with the transition to more sustainable electronic materials. In addition, the AUERI team at Auburn University has kicked off three additional programs in the area of additively manufactured electronics under the latest selection of programs for award under Project Call 8. The first NextFlex program, PC8.2, is on the topic of additive packaging for high-temperature and quantum computing applications. In this program, the AU team is a major subcontractor to Boeing and will work on the development of manufacturing processes and material sets for operation under wide temperature extremes of -269°C to +500°C. In a second program, PC8.3, the Auburn-led team includes partners John Deere, Toyota Motors of North America, BayFlex, and MacDermid Alpha. The project will focus on exploring the process-performance-reliability interactions for in-mold electronics in automotive applications. Two specific automotive platforms for which the technology demonstrators will be created include the farming tractor and the crossover sport utility vehicle. In the third program, PC8.5, the Auburn-led team includes partners Tapecon and BayFlex and focuses on the development of sustainable additively manufactured electronics. A number of methods are being pursued to achieve sustainability, including the use of water-based inks, room-temperature processable interconnects, and biodegradable substrates. In addition to process development, the reliability of the assembled architectures is being studied in environments expected in wearable applications in wear-and-forget formats. In addition to kicking off new programs, we also concluded two programs including PC6.5 on the development of closed-loop control for inkjet additively manufactured electronics. The AUERI team, along with project partners, delivered the closed-loop control software developed under the program along with the hardware instrumentation to enable control of printed dimensions and electrical parameters in a manufacturing environment. In January 2024, we elected a new slate of officers for the AU-SMTA Student Chapter. The Director’s report at the Spring Review 2024 will have more details on the officers' names and designations. The officer team had a strong showing at the Auburn E-day, in which they staffed an SMTA booth to talk to high-school students about electronics manufacturing.

Pradeep Lall,

Recent news, david named associate dean for research.

Allan David has been named associate dean for research for Auburn University’s Samuel Ginn College of Engineering, according to an announcement by Dean Mario Eden.

Auburn center’s FHE reputation underscored with multiple winning additively manufactured electronics proposals

If you're trying to gauge Auburn's preeminence in harsh environment electronics resiliency development and flexible hybrid electronics (FHE) research, look no further than the latest project call of the NextFlex National Manufacturing Institute.

Mechanical engineering professor wins international research award

Pradeep Lall, the MacFarlane Endowed Distinguished Professor of mechanical engineering, is the 2023 recipient of the SEMI FlexTech prestigious FLEXI Award for R&D Achievements. The award, which recognizes world-class research originality in demonstrating the commercial potential for flexible hybrid electronics (FHE) or printed electronics, was conferred at the FLEX Conference held in San Francisco July 11-13.

Auburn University appoints Mario Eden as its new dean of the Samuel Ginn College of Engineering

Following a national search, Mario Eden, the Joe T. and Billie Carole McMillan Professor and chair of Auburn University’s Department of Chemical Engineering, has been named as the 14th dean of the Samuel Ginn College of Engineering, according to an announcement by Interim Provost Vini Nathan.

Mechanical engineering professor wins multiple grants for AM sustainability and extreme environment electronics

The Samuel Ginn College of Engineering’s preeminence in harsh environment electronics resiliency research was recently on full display in the latest project call of the NextFlex National Manufacturing Institute.

Auburn University Board of Trustees approves Applied Research Institute

The Auburn University Board of Trustees approved a proposal Friday to form an Applied Research Institute that will represent an aggregation and culmination of various defense, aerospace, national security and biotech efforts at Auburn University. The proposed institute will serve as a hub to coordinate, organize and market these many efforts to Auburn's external constituents.

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Electronic Research Institute

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As radio receivers moved from the living room to the dashboard, broadcasters demanded new transmission technology. In order to reach this new mobile audience, ERI introduced the now ubiquitous ROTOTILLER® circularly polarized FM antenna. In the decades that followed, the ROTOTILLER® product line expanded with introductions of the X Series and AXIOM™ Series. ERI now offers a complete line of horizontally, vertically, and circularly polarized FM antennas for single-frequency, multiplexed, and broadband applications.

In the early 1990’s, Electronics Research expanded both its corporate headquarters in Chandler, Indiana and its product offering. ERI began designing, manufacturing, and installing broadcast towers. Electronics Research used its combined RF and structural engineering expertise to introduce integrated antenna support structures including the LAMBDA® Optimized FM Mounting System and COGWHEEL® Master FM Antennas.

In addition to the development of a structural product line, ERI expanded its RF products with the launch of a complete line of notch and bandpass filters for FM applications. ERI partnered with iBiquity Digital Corporation to pioneer HD Radio™ implementation technology. The iBOX™ hybrid combiner, LYNX™ dual input/ dual polarized FM antenna, and ROTOTILLER® shared apperture FM antennas are the most recent advances by ERI in the delivery of HD Radio™. As HD Radio™ continues to advance towards full implementation, ERI leads the way with products for FM broadcasters.

As the twenty-first century dawned, Electronics Research once again expanded to meet the needs of the broadcast industry with the acquisition of the broadcast division assets of Andrew Corporation in 2003. This acquisition included complete lines of:

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As ERI continues to meet the changing needs of broadcasters around the world and across the spectrum with innovative, high-quality, and integrated broadcast systems, one thing remains constant: ERI is your single source for broadcast solutions.

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Electronic Materials Research Institute (eMRI)

Director: Srinivas Sridhar, Arts and Sciences Distinguished Professor of Physics

eMRI’s research is focused on developing new materials and devices for nano-, info- and bio-technologies. Comprised of an interdisciplinary team of 14 faculty from chemistry, engineering, physics and pharmaceutical sciences, the eMRI’s research agenda seeks to characterize and control material processes at the nano-, micro- and mesoscales for a variety of applications: controlling light transmission, revolutionary improvements to fuel cells’ performance, computational modeling of processes at the nanoscale, tumor-targeted drug delivery, novel anticancer chemotherapies and mitochondrial gene therapy. eMRI also aims to educate the next generation of scientists and technologists by developing interdisciplinary educational programs at the B.S., M.S., Ph.D. and Certificate levels in nanomaterials science and engineering.

eMRI has a vigorous outreach program to industry and the urban community. eMRI faculty have developed partnerships with industrial companies and government laboratories including the Air Force Research Laboratories at Hanscom, Foster-Miller, Sandia National Laboratories, Denora, United Technologies Corp., Peugeot, Mitovec, Genzyme, Protonex, Nissan and Integrated Fuel Cells. Founded in 2002.

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Russia’s major military electronics producer Platan Electronic Research Institute engulfed in a huge fire

At least eight people have died in the Platan Electronic Research Institute fire near Moscow, the regional Governor Andrey Vorobyov has said.

Emergency officials told the state-owned Tass news agency that just one person was rescued from the blaze at the burning building in Fryazino, about 25km (15.5 miles) north-east of the capital.

Two people were killed after they jumped from a window, while six died when the interior of the office collapsed in the blaze, Mr Voroyov wrote in a post to social media.

Footage online showed thick smoke billowing from the upper floors of the eight-storey complex.

There are conflicting reports about the building’s purpose. It once homed the Platan Research Institute and defence industry, according to Tass.

🔥 Russia: Platan Electronic Research Institute in the Moscow suburb is on fire. The facility was developing radar jamming technology for the Russian military. At least 8 people dead. pic.twitter.com/cOV72roqms — Igor Sushko (@igorsushko) June 24, 2024

A statement to the agency from Ruselectronics, a Russia-owned electronics organisation, said the building has been privately owned since the 1990s.

However, opposition media outlets recently reported that Platan was based in the building as late as 2023.

Mr Vorobyov said that a 34-year-old man had been taken to hospital in a serious condition, while two firefighters were also being treated for injuries sustained in the blaze. Local emergency services said the man was the only person rescued from the blaze.

Emergency ministry officials said over 130 people and two helicopters were working to fight the fire, but that much of it had been “localised” by 20:00 local time (18:00 BST).

It is not immediately clear what caused the fire, but one eyewitness told Tass that it broke out on the sixth floor before spreading. Mr Vorobyov said that around 30 companies rented office space in the building, with the fate of two employees in the building remaining unknown.

Mr Vorobyov added that a criminal case has been opened and prosecutors are investigating what sparked the blaze.

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UT’s Texas Institute for Electronics awarded $840M for tech research and development

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AUSTIN, Texas — The University of Texas at Austin's (UT) Texas Institute for Electronics is getting a large amount of money from the U.S. Department of Defense to continue its work with research and development related to semiconductor chips.

The technology the money will go toward can be used in both radar and unmanned aerial vehicles.

DARPA, or the Defense Advanced Research Project Agency – part of the Department of Defense – awarded the Texas Institute for Electronics $840 million. The institute is also getting more than $500 million from the state.

“This is research and prototyping facility, so it’s really the precursor to scaling of up to manufacturing, that is the focus DARPA has, developing new technologies, emerging technologies making sure we stay ahead globally," said S.V. Sreenivasan, the chief technology officer and founder of the Texas Institute for Electronics.

Sreenivasan said new high-tech machines will go into “new clean rooms” at the J.J. Pickle campus and at its Montopolis campus in southeast Austin.

The initiative will result in the hiring of 200 people and will work with local community colleges.

“Their technician training program – so these are folks with a two-year college degree and training in semiconductors," Sreenivasan said.

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UT’s Texas Institute for Electronics Awarded $840M To Build a DOD Microelectronics Manufacturing Center, Advance U.S. Semiconductor Industry

AUSTIN, Texas — Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense. Under the agreement, TIE will establish a national open access R&D and prototyping fabrication facility that will enable DOD to create higher performance, lower power, light weight and compact defense systems. Such technology could apply to radar, satellite imaging, unmanned aerial vehicles or other systems.

TIE is a UT Austin-supported semiconductor consortium. The new microsystem designs will be enabled by 3D Heterogeneous Integration (3DHI) — a semiconductor fabrication technology that integrates diverse materials and components into microsystems using precision assembly technologies.

“By investing in leading-edge microelectronics manufacturing, we are helping secure this vulnerable supply chain, boosting our national security and global competitiveness, and driving innovation in critical technologies,” said U.S. Sen. John Cornyn. “The next generation of high-performing semiconductors these resources will enable through DARPA’s partnership with UT TIE will help not only bolster our defense but also pave the way for the U.S. to reclaim its leadership role in this critical industry, and I look forward to seeing more Texas-led advancements in the years to come.”

The project represents a total investment of $1.4 billion. The $840 million award from DARPA is a substantial return on the Texas Legislature’s $552 million investment in TIE, which has funded modernization of two UT fabrication facilities to strengthen long-term U.S. technology leadership. These facilities will be open to industry, academia and government, and will create dual-use innovations supporting the defense sector and the semiconductor industry, including startups, advancing technology for the betterment of society.

“The University of Texas is honored to use our vast talent and expertise in service to our country,” said Kevin Eltife, chairman of the UT System Board of Regents. “This partnership will allow UT Austin faculty, staff and students to bolster our national defense and further demonstrate the University’s global leadership in technology-related teaching and research. We are grateful for the Legislature’s strong support of the Texas Institute for Electronics as it continues to feed the Texas economy and create unrivaled opportunities for Longhorns to change the world.”

DARPA’s Next Generation Microelectronics Manufacturing (NGMM) Program is among the largest federal awards ever to any UT System institution. Moreover, it represents significant progress aligned with UT President Jay Hartzell’s 10-year strategic plan for UT to become the world’s highest-impact public research university. The scope of work will complement UT’s strengths in AI, robotics, circuit design and novel electronics systems development and will draw on the considerable talent of the Cockrell School of Engineering .

“The old Wayne Gretzky quote is ‘Skate to where the puck is going,’ and we worked with the state of Texas to do just that and to compete, and it paid off,” Hartzell said. “We have an opportunity to not only give our military a competitive edge, but this is the kind of major opportunity that creates jobs, attracts businesses, will grow Austin’s innovation ecosystem and cement Texas as a leader in microsystems innovation. I am grateful to DARPA for recognizing our talent and facilities as a worthy investment. I am equally grateful for Professor S.V. Sreenivasan, one of the world’s leading experts in semiconductors, for his vision and leadership and constructing a team that will achieve great things.”

“TIE is tapping into the semiconductor talent available in the Cockrell School of Engineering, in Texas and nationally to build an outstanding team of semiconductor technologists and executives that can create this national center of excellence in 3DHI microsystems,” said S.V. Sreenivasan, TIE founder and chief technology officer and UT professor of mechanical engineering. “This includes the hiring of John Schreck, formerly senior VP at Micron Technology, as CEO. We are also investing in workforce development across Texas to create an enduring talent ecosystem that can support TIE’s future needs.”

The program is composed of two phases — each 2.5 years in length. In Phase 1, TIE will establish the center’s infrastructure and basic capabilities. In Phase 2, the center will engineer 3DHI hardware prototypes important to the Department of Defense and automate processes. It will also work with DARPA on separately funded design challenges.

“DARPA’s vision for the NGMM program includes developing an infrastructure that enables users to efficiently and accurately develop advanced microsystems meeting the defense industry’s stringent quality and reliability standards. This includes design collateral, EDA tools supporting three-dimensional constructs, and emerging capabilities like digital twins,” said John Schreck, CEO of TIE. “With the support of our consortium partners, TIE’s product development infrastructure and services will enable a true open access facility where future microsystems can be developed for a wide range of customers and can be leveraged for other programs well into the future.”

TIE established its strategic vision during the past three years in collaboration with key partners across the semiconductor ecosystem. TIE’s NGMM team is composed of 32 defense electronics and leading commercial semiconductor companies and 18 nationally recognized academic institutions.

The Texas Institute for Electronics is a UT Austin-supported semiconductor consortium of state and local government, preeminent semiconductor and defense electronics companies, national labs and nationally recognized academic institutions with 84,000 square feet of state-of-the-art clean room space. Founded in 2021, TIE’s goal is to create a nationally recognized center for excellence in 3DHI technology, pilot fabrication facilities and semiconductor workforce development.

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Electronic Research Archive (ERA) , formerly known as Electronic Research Announcements in Mathematical Sciences , publishes original and expository full-length research articles of significant advances in all branches of mathematics, applied mathematics and related fields. All articles should be written to communicate their contents to a broad scientific audience and must meet high standards for scientific content and clarity. 

Ever since ERA was created by the American Mathematical Society in 1995, the journal has been serving well the community, with its full contents free of charge for both readers/libraries and authors. This has been an extraordinary contribution to the community by AMS and AIMS for over 20 years. To ensure the sustainability of the journal, ERA has been Open Access since 2022, and publishes monthly.

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Texas Institute for Electronics Secures $840M DARPA Award to Establish Microelectronics R&D Center

The Defense Advanced Research Project Agency has awarded $840 million to the Texas Institute for Electronics at the University of Texas at Austin to build a national open-access center to support 3D heterogeneous integration microsystems research, development and low-volume production.

The award was made under the Next-Generation Microelectronics Manufacturing—or NGGM—program, which aims to provide an accessible chip prototyping capability to advance microelectronics innovation, DARPA said Thursday.

As part of the partnership, the Texas Institute for Electronics will establish a consortium to encourage collaboration among the defense industrial base organizations, domestic foundries, vendors and startups, chip designers and manufacturers, and other stakeholders.

According to Whitney Mason, director of DARPA’s Microsystems Technology Office, having an accessible R&D facility “will break down silos and foster an ecosystem that enhances the U.S. competitive advantage.”

The NGMM program is funded by the Department of Defense and is separate from the semiconductor initiative under the CHIPS and Science Act.

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UT Awarded $840M To Build Microelectronics Manufacturing Center, Advance U.S. Semiconductor Industry

The Texas Institute for Electronics (TIE) at The University of Texas at Austin has been selected to engineer the next generation of high-performing semiconductor microsystems.

Under the $840 million agreement with the U.S. Defense Advanced Research Project Agency (DARPA), TIE will establish a national open-access research and development and prototyping fabrication facility to create higher-performance, lower-power, lightweight and compact semiconductor systems. Such technology could apply to advanced computing, radar, satellite imaging and more.

TIE is a UT Austin-supported semiconductor consortium led in part by Texas Engineers. Using 3D Heterogeneous Integration (3DHI) – a semiconductor fabrication technology that integrates diverse materials and components into microsystems using precision assembly technologies – TIE and UT will enable the design of more powerful and compact microsystems, shaping the future of semiconductors globally.

“By investing in leading-edge microelectronics manufacturing, we are helping secure this vulnerable supply chain, boosting our national security and global competitiveness, and driving innovation in critical technologies,” said U.S. John Sen. Cornyn. “The next generation of high-performing semiconductors these resources will enable through DARPA’s partnership with UT TIE will help not only bolster our defense but also pave the way for the U.S. to reclaim its leadership role in this critical industry, and I look forward to seeing more Texas-led advancements in the years to come.”

UT and TIE have now secured a total of $1.4 billion to engineer the next generation of semiconductors, which power everything from our phones to lifesaving medical equipment. The $840 million award from DARPA is a substantial return on the Texas Legislature’s $552 million investment in TIE, which has funded modernization of two UT fabrication facilities to strengthen long-term U.S. technology leadership. These facilities will be open to industry, academia and government, and will create dual-use innovations supporting the defense sector and the semiconductor industry, including startups, advancing technology for the betterment of society.

“The University of Texas is honored to use our vast talent and expertise in service to our country,” said Kevin Eltife, chairman of the UT System Board of Regents. “This partnership will allow UT Austin faculty, staff and students to bolster our national defense and further demonstrate the University’s global leadership in technology-related teaching and research. We are grateful for the Legislature’s strong support of the Texas Institute for Electronics as it continues to feed the Texas economy and create unrivaled opportunities for Longhorns to change the world.”

DARPA’s Next Generation Microelectronics Manufacturing (NGMM) Program is among the largest federal awards ever to any UT System institution. Moreover, it represents significant progress aligned with UT President Jay Hartzell’s 10-year strategic plan for UT to become the world’s highest-impact public research university. The scope of work will complement UT’s strengths in AI, robotics, circuit design and novel electronics systems development and will draw on the considerable talent of the Cockrell School of Engineering.

“The old Wayne Gretzky quote is ‘Skate to where the puck is going,’ and we worked with the state of Texas to do just that and to compete, and it paid off,” Hartzell said. “We have an opportunity to not only give our military a competitive edge, but this is the kind of major opportunity that creates jobs, attracts businesses, will grow Austin’s innovation ecosystem and cement Texas as a leader in microsystems innovation. I am grateful to DARPA for recognizing our talent and facilities as a worthy investment. I am equally grateful for Professor S.V. Sreenivasan, one of the world’s leading experts in semiconductors, for his vision and leadership and constructing a team that will achieve great things.”

“TIE is tapping into the semiconductor talent available in the Cockrell School of Engineering, in Texas and nationally to build an outstanding team of semiconductor technologists and executives that can create this national center of excellence in 3DHI microsystems,” said S.V. Sreenivasan, TIE founder and chief technology officer and professor in the Cockrell School’s Walker Department of Mechanical Engineering. “This includes the hiring of John Schreck, formerly senior VP at Micron Technology, as CEO. We are also investing in workforce development across Texas to create an enduring talent ecosystem that can support TIE’s future needs.”  

The program is composed of two phases — each 2.5 years in length. In Phase 1, TIE will establish the center’s infrastructure and basic capabilities. In Phase 2, the center will engineer 3DHI hardware prototypes important to the Department of Defense and automate processes. It will also work with DARPA on separately funded design challenges.  

“DARPA’s vision for the NGMM program includes developing an infrastructure that enables users to efficiently and accurately develop advanced microsystems meeting the defense industry’s stringent quality and reliability standards. This includes design collateral, EDA tools supporting three-dimensional constructs, and emerging capabilities like digital twins,” said John Schreck, CEO of TIE. “With the support of our consortium partners, TIE’s product development infrastructure and services will enable a true open access facility where future microsystems can be developed for a wide range of customers and can be leveraged for other programs well into the future.”

TIE established its strategic vision during the past three years in collaboration with key partners across the semiconductor ecosystem. TIE’s NGMM team is composed of 32 defense electronics and leading commercial semiconductor companies and 18 nationally recognized academic institutions.

The Texas Institute for Electronics is a UT Austin-supported semiconductor consortium of state and local government, preeminent semiconductor and defense electronics companies, national labs and nationally recognized academic institutions with 84,000 square feet of state-of-the-art clean room space. Founded in 2021, TIE’s goal is to create a nationally recognized center for excellence in 3DHI technology, pilot fabrication facilities and semiconductor workforce development.

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• Higher Education: The ERI implemented 12 research projects with a value of 31 million pounds during 2021

Higher Education: The Electronics Research Institute implemented 12 research projects with a value of 31 million pounds during 2021

Dr. Khaled Abdel Ghaffar, Minister of Higher Education and Scientific Research, received a report submitted by Dr. Sherine Abdel Qader Muharram, Acting President of the Electronics Research Institute, on the Institute’s performance harvest for the year 2021.

The report said that in 2021, the institute published 155 scientific papers, the Institute’s members receiving 23 scientific awards in various fields, the Institute’s membership in scientific journals reached 24, and the Institute’s members have authored 8 scientific books.

The report also stated that the institute organized 49 training courses, the number of conferences participating in it reached 37, the number of workshops implemented by the institute reached 65 workshops, the number of international arbitrations reached 145 international arbitrations and the institute obtained a patent during the year entitled "Method of To determine the angle and frequency of the electrical network using virtual power”.

The institute implemented 12 external research projects in 2021 with a total EGP 31,400,000 estimated budget and 10 internal research projects with a total EGP 2,900,000 estimated budget. Some of the notable projects are:

-a precise and insatiable current transformer for measuring alternating current.

-Power frequency Innovative design based on hybrid system of vertical axis wind turbines combined with self-controlled solar panels to boost renewable electric energy

-Mobile phone transmitter and receiver in LTE frequency domain

-Intelligent management of water resources based on the use of green energy and Internet of things, among others projects.

The report stated that the institute had signed a number of local and international contracts and protocols with a number of authorities.

The report indicated the readiness of 7 specialized laboratories, equipped at the highest level, to receive clients from the research and development departments in industrial and telecommunications companies, government and private laboratories and independent researchers. The Laboratories are also available to individuals who support the efforts of the Institute in service of scientific research, civil and industrial societies. These labs are:

-Specific Absorption Rate Measurement Laboratory

-Millimeter wave measurement lab,

-printed circuit manufacturing lab,

-X-Ray Diffraction lab,

-Design and modeling lab,

 -Lithium-ion battery research and manufacturing lab,

-Electronic waste lab.

The report added some of the notable events that the institute was involved in during 2021:

-winning the best website award at the level of research institutes and centers

-Launching the Iprenuer initiative to support the establishment of start-up companies for researchers in cooperation with the Center Industrial modernization of the Ministry of Trade and Industry

-The launch of the opening ceremony of the African Innovation and Technology Forum, which was held from 12-13 November 2021 in cooperation with a company, and with the participation of many African countries

-The completion of market and economic feasibility studies for the implementation of the construction of the clean room in the institute.

The report pointed to the institute’s success in making a preliminary version of a number of marketable products including:

-A portable device for rapid detection of viruses and bacteria in biological samples.

-The design and implementation of antennas for mobile phone stations for the second, third and fourth generation.

-Ground penetrating radar.

-An energy monitoring device for wireless sensors in Internet systems.

-A device for securing museums using microwaves.

-The design and manufacture of some sub-systems as spare parts for radar devices

-A programmable sound and light alarm to protect the internal combustion engines of cars from exceeding the safe limit

-Solar panels with a capacity of about 250 watts.

The report added some products close to developing a prototype:

-The Cubsat satellite communications system in the S-band frequency range

-Apump protection device from dry circulation without mechanical sensor

-An electronic chip for a low-power transmission in the ultra-wide frequency range

The report noted some products where most of the technical knowledge necessary for their development and production has been acquired through participation in research projects:

-Tissue micro sensors for breast cancer detection.

-The local manufacture of a sewage treatment smart device for domestic and industrial uses using the Internet of Things.

-A vital signs monitoring sensor for Measuring the water level in the human lung.

-A three-level solar energy inverter with a capacity of 20 kilowatts to connect to the electric grid.

-The use of the smart agent with the help of natural language in education.

-A smart program for verbal math problems.

The report concluded by providing a number of the institute’s technical engineering and manufacturing consultancies for all industrial productive sectors:

-The design, manufacture and measurement of micro-tape circuits and flat antenna systems in the microwave frequencies range.

-The field of textile industries

- The field of manufacturing medical devices for the detection of bacteria and viruses in biological samples.

-Designing and manufacturing spare parts for devices such as radars of all kinds that operate in the microwave range.

-Supervising the implementation of solutions to address electrical energy quality problems.

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TXST named part of Texas Institute for Electronics consortium to advance U.S. semiconductor industry

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Jayme Blaschke | July 19, 2024

Texas State University has been named part of the Texas Institute for Electronics (TIE) consortium to develop the next generation of high-performing semiconductor microsystems for the Department of Defense. 

The $840 million project is part of the Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act and is sponsored by the Defense Advanced Research Project Agency (DARPA). 

Under the agreement, TIE, which is based at the University of Texas at Austin, will establish a national fabrication facility for R&D and prototyping to enable the DOD to create higher performance, lower power, light weight and compact defense systems. Such technology could apply to radar, satellite imaging, unmanned aerial vehicles or other systems.

“With its faculty expertise, semiconductor research facilities and undergraduate and graduate programs that enable the development of a qualified workforce, Texas State University is well position to support the nation and the state of Texas for the objectives of the Federal and Texas CHIPS acts,” said Shreek Mandayam, TXST vice president for research.

The new microsystem designs will be enabled by 3D Heterogeneous Integration (3DHI) — a semiconductor fabrication technology that integrates diverse materials and components into microsystems using precision assembly technologies.

The program is composed of two phases, each 2.5 years in length. In Phase 1, TIE will establish the center’s infrastructure and basic capabilities. In Phase 2, the center will engineer 3DHI hardware prototypes important to the DOD and automate processes. It will also work with DARPA on separately funded design challenges.   

TIE established its strategic vision during the past three years in collaboration with key partners across the semiconductor ecosystem. TIE’s Next Generation Microelectronics Manufacturing team is composed of 32 defense electronics and leading commercial semiconductor companies and 18 nationally recognized academic institutions. 

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Polina Anikeeva named head of the Department of Materials Science and Engineering

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Polina Anikeeva PhD ’09, the Matoula S. Salapatas Professor at MIT, has been named the new head of MIT's Department of Materials Science and Engineering (DMSE), effective July 1.

“Professor Anikeeva’s passion and dedication as both a researcher and educator, as well as her impressive network of connections across the wider Institute, make her incredibly well suited to lead DMSE,” says Anantha Chandrakasan, chief innovation and strategy officer, dean of engineering, and Vannevar Bush Professor of Electrical Engineering and Computer Science.

In addition to serving as a professor in DMSE, Anikeeva is a professor of brain and cognitive sciences, director of the K. Lisa Yang Brain-Body Center, a member of the McGovern Institute for Brain Research, and associate director of MIT’s Research Laboratory of Electronics.

Anikeeva leads the MIT Bioelectronics Group, which focuses on developing magnetic and optoelectronic tools to study neural communication in health and disease. Her team applies magnetic nanomaterials and fiber-based devices to reveal physiological processes underlying brain-organ communication, with particular focus on gut-brain circuits. Their goal is to develop minimally invasive treatments for a range of neurological, psychiatric, and metabolic conditions.

Anikeeva’s research sits at the intersection of materials chemistry, electronics, and neurobiology. By bridging these disciplines, Anikeeva and her team are deepening our understanding and treatment of complex neurological disorders. Her approach has led to the creation of optoelectronic and magnetic devices that can record neural activity and stimulate neurons during behavioral studies.

Throughout her career, Anikeeva has been recognized with numerous awards for her groundbreaking research. Her honors include receiving an NSF CAREER Award, DARPA Young Faculty Award, and the Pioneer Award from the NIH's High-Risk, High-Reward Research Program. MIT Technology Review named her one of the 35 Innovators Under 35 and the Vilcek Foundation awarded her the Prize for Creative Promise in Biomedical Science.

Her impact extends beyond the laboratory and into the classroom, where her dedication to education has earned her the Junior Bose Teaching Award, the MacVicar Faculty Fellowship, and an MITx Prize for Teaching and Learning in MOOCs. Her entrepreneurial spirit was acknowledged with a $100,000 prize in the inaugural MIT Faculty Founders Initiative Prize Competition, recognizing her pioneering work in neuroprosthetics.

In 2023, Anikeeva co-founded Neurobionics Inc., which develops flexible fibers that can interface with the brain — opening new opportunities for sensing and therapeutics. The team has presented their technologies at MIT delta v Demo Day and won $50,000 worth of lab space at the LabCentral Ignite Golden Ticket pitch competition. Anikeeva serves as the company’s scientific advisor.

Anikeeva earned her bachelor's degree in physics at St. Petersburg State Polytechnic University in Russia. She continued her education at MIT, where she received her PhD in materials science and engineering. Vladimir Bulović, director of MIT.nano and the Fariborz Maseeh Chair in Emerging Technology, served as Anikeeva’s doctoral advisor. After completing a postdoctoral fellowship at Stanford University, working on devices for optical stimulation and recording of neural activity, Anikeeva returned to MIT as a faculty member in 2011.

Anikeeva succeeds Caroline Ross, the Ford Professor of Engineering, who has served as interim department head since August 2023.

“Thanks to Professor Ross’s steadfast leadership, DMSE has continued to thrive during this period of transition. I’m incredibly grateful for her many contributions and long-standing commitment to strengthening the DMSE community,” adds Chandrakasan. 

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Jul. 22, 2024

Rice researchers advancing microelectronics manufacturing on darpa-funded team.

A large collaborative team led by the University of Texas at Austin with Rice University as a key partner was awarded $840 million to develop the next generation of high-performing semiconductor microsystems for the U.S. Department of Defense.

On July 18, the Defense Advanced Research Projects Agency (DARPA) selected UT’s semiconductor consortium, the  Texas Institute for Electronics  (TIE), to establish a national open access R&D and prototyping fabrication facility to ensure America’s national security and global military leadership. The facility will enable DOD to create higher performance, lower power, lightweight and compact defense systems. Such technology could apply to radar, satellite imaging, unmanned aerial vehicles or other systems.

The new microsystem designs will be enabled by 3D heterogeneous integration (3DHI) — a semiconductor fabrication technology that integrates diverse materials and components into microsystems using precision assembly technologies.

As a member of DARPA’s Next Generation Microelectronics Manufacturing (NGMM) team, the Rice researchers led by  Ramamoorthy Ramesh , executive vice president for research, will focus on technologies for improving computing efficiency. An internationally recognized leader in materials science and physics with applications to energy, Ramesh emphasized the urgent need to enhance energy-efficient computing, highlighting Rice’s unique qualifications to contribute to the solution.

“Given the rapid growth of machine learning AI applications, there is a pressing need to fundamentally rethink current computing methodologies to advance the next generation of microelectronics. Rice University boasts world-class researchers with exceptional expertise in computer and electrical engineering poised to bolster this critical federally funded initiative,” Ramesh said. The company he co-founded, Kepler Computing, is a member of the NGMM team and utilizes ferroelectrics to develop energy-efficient approaches in computer memory and logic.

Other Rice researchers involved in the project include Lane Martin, director of the Rice Advanced Materials Institute; Ashok Veeraraghavan, chair of electrical and computer engineering; Pulickel Ajayan, the Benjamin M. and Mary Greenwood Anderson Professor of Engineering and founding chair of the materials science and nanoengineering department; Kaiyuan Yang, associate professor of electrical and computer engineering; and Guha Balakrishnan, assistant professor of electrical and computer engineering.

“By investing in leading-edge microelectronics manufacturing, we are helping secure this vulnerable supply chain, boosting our national security and global competitiveness and driving innovation in critical technologies,” said U.S. Sen. John Cornyn.

The project represents a total investment of $1.4 billion. The $840 million award from DARPA is a substantial return on the Texas Legislature’s $552 million investment in TIE, which has funded modernization of two UT fabrication facilities to strengthen long-term U.S. technology leadership. These facilities will be open to industry, academia and government, and will create dual-use innovations supporting the defense sector and the semiconductor industry, including startups, advancing technology for the betterment of society.

TIE’s  NGMM team  is composed of 32 defense electronics and leading commercial semiconductor companies and 18 nationally recognized academic institutions.

“TIE is tapping into the semiconductor talent available in Texas and nationally to build an outstanding team of semiconductor technologists and executives that can create this national center of excellence in 3DHI microsystems,” said S.V. Sreenivasan, TIE founder and chief technology officer and UT professor of mechanical engineering.

The program is composed of two phases — each 2.5 years in length. In Phase 1, TIE will establish the center’s infrastructure and basic capabilities. In Phase 2, the center will engineer 3DHI hardware prototypes important to the DOD and automate processes. It will also work with DARPA on separately funded design challenges.

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DARPA picks UT Austin to house microelectronics manufacturing hub

The Defense Advanced Research Projects Agency and the University of Texas at Austin announced Thursday a $1.4 billion, five-year partnership to establish the first U.S. hub for advanced microelectronics manufacturing .

The investment is part of DARPA’s Next-Generation Microelectronics Manufacturing program, or NGMM. The effort will fund the research and equipment to create a domestic center for prototyping cutting-edge fabrication techniques, which DARPA hopes will give the U.S. semiconductor industrial base a leading edge .

Under the agreement, DARPA will provide $840 million, which builds on a $522 million investment from the state of Texas in UT Austin’s Texas Institute for Electronics, which will house the center. The goal is to stand up the new hub by 2029.

“The consortium will leverage partnerships spanning organizations — across the defense industrial base, domestic foundries, vendors and startups, designers and manufacturers, members of academia, and other stakeholders — to achieve a shared vision of national and economic security,” DARPA said in a July 18 statement.

In the past three decades, the U.S. has gone from producing 37% of the global microchip supply to around 12%. Today, Taiwan produces most of the global supply of advanced semiconductors, and China exports a large portion of its microchips to the United States. These chips power everything from cell phones to cars to the F-35 fighter jet.

DARPA has been working to strengthen the domestic microelectronics industrial and research base since the 1980s and more recently has committed nearly $5 billion through its Electronics Resurgence Initiative , or ERI. The effort includes several programs designed to tackle key technological barriers facing commercial industry and national security agencies.

NGMM is part of that work. The new center will focus on 3D heterogeneously integrated microsystems, or 3DHI — an advanced approach to microelectronics fabrication. The premise of 3DHI research is that by integrating and packaging chip components differently, manufacturers could disaggregate functions like memory and processing to significantly improve performance.

“This accessibility to researchers from academia, government, and industry will break down silos and foster an ecosystem that enhances the U.S. competitive advantage,” Whitney Mason, the head of DARPA’s Microsystems Technology Office, said in the statement.

The five-year effort is split into two phases. During Phase 1, the university will establish the center’s foundational capabilities and infrastructure. In Phase 2, the facility will begin manufacturing the 3DHI prototypes and will work with DARPA to fund design challenges.

In a statement, UT Austin said its microelectronics consortium today includes 32 defense and commercial electronics companies and 18 academic institutions.

DARPA’s announcement follows Congress’ 2022 passage of the Creating Helpful Incentives to Produce Semiconductors, or CHIPS Act . The measure provided nearly $52 billion for near-term efforts to improve microelectronics workforce, research and development, and manufacturing across the United States.

DARPA did not receive CHIPS funding to support the NGMM hub, but Mason noted that its goals are aligned with and bolstered by the initiative.

“We can’t overstate need for constant and unwavering forward momentum in microelectronics capabilities,” she said. “The CHIPS Act’s near-term emphasis can help reinforce NGMM’s work toward realizing the next major wave of microelectronics innovation.”

Courtney Albon is C4ISRNET’s space and emerging technology reporter. She has covered the U.S. military since 2012, with a focus on the Air Force and Space Force. She has reported on some of the Defense Department’s most significant acquisition, budget and policy challenges.

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